Dir, Mfg Equipment & Process Engineering

Req ID: 116187 
Remote Position: No
Region: Asia 
Country: Thailand 
State/Province: Chonburi 
City:  Laem Chabang 

Detailed Description:

Job Summary:

The Director, Manufacturing Equipment & Process Engineering is responsible for leading and managing the work of those responsible for designing, developing, deploying and optimizing processes and equipment for manufacturing to achieve quality cost and delivery goals for Celestica and its customer’s products.

Detailed Description:

Performs tasks such as, but not limited to, the following:

• Set yearly plans and goals for multiple departments and/or senior individual contributors to achieve established objectives and to provide direction on expected performance. Provide regular performance evaluations and ongoing feedback.

• Identify and ensure timely, cost-effective completion of new customer-specific process and/or equipment development projects and sourcing of equipment solutions across a large site, geographic region or globally.

• Identify and direct all departments and resources to execute the scope of all manufacturing technical work. Coordinate the team, direct work assignments and assist with problem resolution for Quality and delivery of manufacturing solutions for the full customer product life cycle. Support for all manufacturing technical issues related to the customer’s product(s) from product conception to product obsolescence.

• Ensure comprehensive evaluations, optimization and tradeoffs occur for all DFX issues with suppliers, customers, supply chain and equipment leaders to deliver a cost-optimized total manufacturing solution across a broad scope of manufacturing sectors within a site or region.

• Influential leader in effective collaboration between teams within Celestica.

• Represent Celestica’s engineering brand by effectively participating in industry organizations. Support the development of the industry standards in specific manufacturing sections and ensure appropriate training programs are in place to deploy cost optimized processes for manufacturing.

Enabling Competencies:

• • Project Management - Ability to lead high value, complex, multifunctional projects that involve accountability to executive management or directly to the customer. Ability to influence decision makers to ensure that the right financial and people resources are allocated to your project, while ensuring that project ROR is in the desired range. Able to consider non-conventional technical solutions and acquire external knowledge and best practices into the project.

  • Leadership - Demonstrate "Executive Leadership Behaviors" as per Celestica Leadership Imperatives.

  • Financial Acumen / Business Planning - Develop strategic plans on business unit or total company level to ensure all engineering work is financially viable and deliver the right ROI for the company. Engaged in developing billing and accounting methods for engineering work, participate in benchmarking, understand and apply best market practices to make engineering delivery financially attractive to our internal and external partners.

  • The following competencies may also be required and performed with help or under supervision: Coaching/Mentoring; Communication/Negotiation/Presentation; Creative Problem Solving; Customer Interaction/Stakeholder Management; Quality & Lean; Working Effectively with Others; D/PFMEA; 8D/Corrective Action; Equipment Safety; Design of Experiments (DOE)

Technical Competencies:

The following are the associated Technical Competencies that are required for the various Standard Jobs within the Manufacturing Equipment & Process Engineering career stream. This list is for illustrative purposes and may not be inclusive of all skills.

Standard Job : Technical Skills

• • EQUIPMENT ENGINEERING MANUFACTURING OPERATIONS : ESD Controls, Component Prep, Component Module Programming, Laser marking, Screening, Solder Paste Dispensing / Jetting, SMT Placement, SMT Reflow, PTH Soldering, Robotic Soldering, PTH Auto Assembly, PTH Press Fit Assembly, Depanelization, Mechanical Assembly - Hotbar, Mechanical Assembly - Heatstking / Ultrasonic Welding, Auto Wire Prep, SMT Automated Rework, PTH Automated Repair, Cleaning Processes, Conformal Coating, Edge Bonding, Underfill, Potting, DFM - Manufacturing, DFA - Assembly, DFAA - Automated Assembly

  • EQUIPMENT ENGINEERING MANUFACTURING DEVELOPMENT : Electrical Design - Automation, Mechanical Design - Automation, PLC Programming, Robotic Programming, Machine Vision, Automation - Machine Safety, Automation - Machine Standards, Automation - Validation

  • EQUIPMENT ENGINEERING SOLUTION ARCHITECT : Automation, Design - DFM - Manufacturing, DFA - Assembly, DFAA - Automated Assembly -URS - Concept design and Costing.

  • NPI-PCBA: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.

  • DFX: ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assemb;y (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills / Edgebonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal , Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe)

  • FA LAB : ESD Controls, Solder Metallurgy, Strain Gauge Analysis, SIR Testing, Solder Joint Reliability Modeling, Sample Prep (Grind and Polish), Dye & Pry, CMM/VMM, Lab Xray, Pull/Bend Testing, Vibration Testing, Drop Testing, TDR, XRF, SEM, FTIR, IC, Solderability Testing, Thermal Analysis, HALT/HASS, TH&B, Thermal Shock, ATC

  • OPTICAL & XRAY INSPECTION : ESD Controls, Auto Wire Prep, SMT Data Analytics, API, AOI (PCBA), AXI (PCBA), AOI (System), Test Strategy Creation, IPC-610, Quality Dat (KPI), DFM - Manufacturing, DFA - Assembly, DFT / Physical Test, DFT - Electrical Test

  • MACHINING & OTHER : ESD Controls, Pack & Ship, CNC programming, Secondary Processing, Sheet Metal, Machining, Welding, DFM - Manufacturing

  • MECHANICAL & SYSTEMS ASSEMBLY : ESD Controls, Wire Harness Assembly, Auto Wire Prep, Mechanical Assembly - System Build, OEE / Industrial Engineering, Pack & Ship, Vacuum System, Fluidics, Electrical Enclosure, Cable Routing, Electrical - Automation, Mechanical - Automation, Machine Vision, IPC-610, Engineering Controls, Quality Data (KPI), Manufacturing Operational Management, DFM - Manufacturing, DFA - Assembly, DFAA - Automated Assembly, DFT - Physical Test

  • PCBA ASSEMBLY : ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes.

  • MICROELECTRONICS : ESD Controls, Wafer Thinning, Wafer Singulation, Edge Polishing, Optical Coatings, Die Bonding, Vacuum Reflow, Flip Chip Bonding, Underfill, Active Alignment, Plasma Cleaning, Wire Bonding, Encapsulation, Sealing, Leak Testing, Interconnect Formation

Physical Demands:

Duties of this position are performed in a normal office environment.

Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data.

Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.

Occasional travel may be required.

Typical Experience:

15+ years.

Typical Education:

Bachelor degree

Notes: This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.

Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).
At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.

COMPANY OVERVIEW:
Celestica (NYSE, TSX: CLS) enables the world’s best brands. Through our recognized customer-centric approach, we partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for their most complex challenges. As a leader in design, manufacturing, hardware platform and supply chain solutions, Celestica brings global expertise and insight at every stage of product development – from drawing board to full-scale production and after-market services for products from advanced medical devices, to highly engineered aviation systems, to next-generation hardware platform solutions for the Cloud. Headquartered in Toronto, with talented teams spanning 40+ locations in 13 countries across the Americas, Europe and Asia, we imagine, develop and deliver a better future with our customers.

Celestica would like to thank all applicants, however, only qualified applicants will be contacted.
Celestica does not accept unsolicited resumes from recruitment agencies or fee based recruitment services.