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Manufacturing Engineer-Micro Electronics (Process/Equipment, Flip Chip, Die Bonding, Wire Bonding)

Date: Feb 12, 2021

Location: Laem Chabang, TH

Company: Celestica International Inc.

Req ID: 68189 
Region: Asia 
Country: Thailand 
State/Province: Chonburi 
City:  Laem Chabang 

Responsibilities;
Responsible for underfill process that related to flip chip attach, die attachment, wire bonding, processes & equipment.
Take care of wafer cleaning and Known Good Die/flip chip processes
Develop process/yield improvement which related to assembly processes


Bachelor’s Degree or higher in Electronics, Electrical or Mechanical Engineering or related field
5 - 10 years of work experience in IC assembly background preferably in Die Attach, flip chip attach
Good command of written and spoken English
Computer skill: Microsoft Office

COMPANY OVERVIEW:
Celestica (NYSE, TSX: CLS) is a US$5.8 billion global leader in the delivery of end-to-end product lifecycle solutions. Our customers trust us to deliver the most advanced design, engineering and manufacturing expertise for their highly sophisticated and complex products. From advanced medical devices, to highly engineered aviation systems, to next-generation hardware solutions for the Cloud, at Celestica we manage the complexity for our customers and set the bar for quality and reliability in their markets. Our customer portfolio includes leaders in the enterprise computing, communications, aerospace and defense, industrial, smart energy, healthtech and semiconductor markets. Headquartered in Toronto, our global network spans 13 countries with 26,000 employees throughout the Americas, Europe and Asia.


Job Segment: Process Engineer, Electrical, Engineer, Electronics Engineer, Manufacturing Engineer, Engineering