09 - Senior Lead Engineer, Manufacturing Process

Summary

The Senior Lead Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

Detailed Description

Performs tasks such as, but not limited to, the following:

• Responsible for understanding and implementing the customers technical roadmap and related process development projects.
• Lead and implement the development and release of the full manufacturing process for new customer products.
• Understand and provide feedback on customers technical requirements to team members and management
• Responsible for developing and implementing costed and optimized feedback using Design for manufacturability (DFX) tools and processes, with the goal of reducing manufacturing cost and improving quality and reliability of product.
• Develop, plan and lead the assessment of the capability of process applications using Design of Experiments.
• Devise process controls and data collection strategies and evaluate complex data to assist with reporting yield, reliability and diagnoses to root causes failures impacting product quality.
• Ensure accurate and timely communication to management on critical technical and business issues.

Knowledge/Skills/Competencies

• Project Management - Ability to manage/lead complex, multiple line engineering projects that may also involve other functions. Demonstrate solid understanding of the technical, financial and people aspects of the project. Able to create a project/change management plan and ensure that the project is delivered within the assigned time and budget. Ability to recognize project barriers and develop mitigation plans
• Leadership - Demonstrate "People & Team Leadership Behaviors" as per Celestica Leadership Imperatives.

• The following competencies may also be required: Coaching/Mentoring; Communication/Negotiation/Presentation; Creative Problem Solving; Customer Interaction/Stakeholder Management; Quality & Lean; Working Effectively with Others; D/PFMEA; 8D/Corrective Action; Equipment Safety; Design of Experiments (DOE). 

• NPI-PCBA: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.    

Physical Demands

• Duties of this position are performed in a normal office environment.
• Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data. 
• Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.
• Occasional travel may be required.

Typical Experience

• 4 to 6 years in a similar role or industry.

Typical Education

Bachelor degree or consideration of an equivalent combination of education and experience.

Educational Requirements may vary by Geography

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.