08 - Lead Engineer, Manufacturing Process

Summary

The Lead Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

Detailed Description

Performs tasks such as, but not limited to, the following:

• Prepare and optimize production data for PCB Assembly, ensuring efficient and high-quality output.
• Create and maintain detailed production routings in SAP and Spectrum Pro (SP2), optimizing the material and product flow.
• Develop clear and concise PCB assembly instructions, considering the requirements and capabilities of the production.
• Manage stencil optimization and inventory, ensuring timely delivery and optimal use.
• Oversee the launch of new products, creating all necessary documentation and coordinating with cross-functional teams.
• Manage product changes and version control, ensuring all relevant parties are informed.
• Collaborate closely with production and product development teams, providing technical expertise and support, and fostering a strong team environment.
• Preparing NPI for new models and Design for Manufacturing (DFM).
• Preventing and eliminating process defects and maintaining quality levels
• Liaise with the departments and work together (I.E, Quality and Product Engineering) during new product introductions (NPI) stage
• Design and fabricate jig and fixtures and register into system.
• Documentation new equipment and other capital requirement to meet customer demand and maintaining the company’s technology level in line with Industrial trends.
• Perform process validation from front to end PCB assembly process
• Propose to superior suitable process or machine for manufacturing process.
• Responsible to up the machine if machine break-down or follow-up with supplier.
• Participating in all meeting as required. Exp. SCAR meeting, FA run, FMEA.
• Supervise Technician and Repairer.
• Assist Manager to do data analysis, capability studies on machine and product.
  
  
  

Knowledge/Skills/Competencies

• Degree in Electrical/Electronics/Mechanical Engineering
• 8-10 years of working experience in EMS environment.
• Trained and understand ISO working procedures.
• Familiar engineering documentation BOM/ECN implementation.
• In-depth knowledge and understanding of the design process for systems and printed circuit boards, subassemblies, or other related company products
• In-depth knowledge of manufacturing processes and equipment used for systems and printed circuit boards and subassemblies
• In-depth knowledge of industry and quality standards and SPC methodologies
• In-depth knowledge of materials and components used in the construction of systems and printed circuit boards and subassemblies.
• 3-5 years people management skills, Systematic job load assignments to subordinate

Physical Demands

• Duties of this position are performed in a normal office environment.
• Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data. 
• Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.
• Occasional travel may be required.

Typical Experience

• 1 to 3 years of related experienc;Experience in similar job roles

Typical Education

Bachelor degree or consideration of an equivalent combination of education and experience.

Educational Requirements may vary by Geography

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.