Application Engineering Manager

Summary

As a senior expert in the field of Printed Circuit Board (PCB) and Surface Mount Technology (SMT) assembly, you will play a core role in making PCB technology and SMT assembly decisions, collaborating across teams, and solving problems throughout the entire product lifecycle (from R&D design to mass production management). You will be responsible for the inheritance and innovation of PCB and its SMT assembly technologies, ensuring that the product's PCB design meets the industry's top standards for SMT mass production feasibility and supports large-scale mass production. #LI-WP1 

Detailed Description

Performs tasks such as, but not limited to, the following:

• Lead PCB technical evaluation of new products, identify risks, and ensure IPC/JEDEC compliance.
• Provide DFx guidance, optimize PCB stack-up, routing, and pad design for manufacturability.
• Lead cross-functional teams to resolve PCBA issues (ASICs, high-frequency connectors, flatness, etc.).
• Support DOE for SMT process parameters to achieve target yield in mass production.
• Design PCBA verification plans, review reliability test results, and develop DOE test standards.
• Support certification of alternative components, BOM updates, and PCB adaptability reviews.
• Guide setup of PCBA testing in production (AOI, flying probe, calibration) and ensure equipment readiness.
• Coordinate engineering resources across projects to avoid conflicts.
• Conduct training, build PCB/PCBA knowledge base, and share best practices.
• Explore next-gen PCB technologies (HDI, flexible PCB, VIPPO, large ASIC placement, rework) and validate feasibility.

Knowledge/Skills/Competencies

• Strong knowledge of PCB design (stack-up, impedance, signal/power integrity) and SMT PCBA processes.
• Proficient in DOE tools, PCB materials (FR-4, high-speed), and mass production processes (immersion gold, OSP, buried/blind vias).
• Ability to interpret and revise industry standards (IPC, JEDEC).
• Strategic thinking to plan long-term PCB/SMT technology roadmap.
• Strong communication and leadership skills to drive cross-team collaboration.
• Detail-oriented with ability to turn complex technologies into executable plans.
• Capable of training and knowledge transfer on advanced PCB/PCBA methods.

Typical Experience

• 15+ years of overall relevant experience preferred.
• 8+ years of PCBA engineering experience in the server, switch, and access switch fields.
• Have leadership experience in PCB design and SMT projects for servers and high-speed communication equipment; have successful cases of solving extremely complex PCBA component placement problems.

Typical Education

• Educational Background: Bachelor's degree or above in Electronic Engineering, Microelectronics, PCB Design and SMT Process-related majors;
• Priority will be given to candidates with IPC design certifications (such as IPC610, IPC-2221, IPC-6012).
• Educational Requirements may vary by Geography

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.