Director, Manufacturing Equipment & Process Engineering 1

Summary

The Director, Manufacturing Equipment Process Engineering is responsible for leading and managing the work of those responsible for designing, developing, deploying and optimizing processes and equipment for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

Detailed Description

Performs tasks such as, but not limited to, the following:

• Set yearly plans and goals for multiple departments and/or senior individual contributors to achieve established objectives and to provide direction on expected performance. Provide regular performance evaluations and ongoing feedback.
• Identify and ensure timely, cost-effective completion of new customer-specific process and/or equipment development projects and sourcing of equipment solutions across a large site, geographic region or globally.
• Identify and direct all departments and resources to execute the scope of all manufacturing technical work. Coordinate the team, direct work assignments and assist with problem resolution for Quality and delivery of manufacturing solutions for the full customer product life cycle. Support for all manufacturing technical issues related to the customers product(s) from product conception to product obsolescence.
• Ensure comprehensive evaluations, optimization and tradeoffs occur for all DFX issues with suppliers, customers, supply chain and equipment leaders to deliver a cost-optimized total manufacturing solution across a broad scope of manufacturing sectors within a site or region.
• Influential leader in effective collaboration between teams within Celestica.
• Represent Celesticas engineering brand by effectively participating in industry organizations. Support the development of the industry standards in specific manufacturing sections and ensure appropriate training programs are in place to deploy cost optimized processes for manufacturing.

Knowledge/Skills/Competencies

• Core PCBA & Microelectronics Manufacturing: End-to-end expertise in Printed Circuit Board Assembly (PCBA) and microelectronics. This spans SMT/PTH placement, reflow, specialized soldering, conformal coating, potting, and advanced wafer processing techniques (die/wire bonding, flip chip, and encapsulation).

• Equipment Engineering, Automation & Mechanical Assembly: Development and deployment of automated manufacturing solutions and complex system builds. This includes robotics, PLC programming, machine vision, CNC machining, sheet metal fabrication, and full-system mechanical assemblies involving fluidics, vacuum systems, and electrical enclosures.

• Design for Excellence (DFX) & New Product Introduction (NPI): Integration of manufacturing feasibility into the product lifecycle. This covers Design for Manufacturing, Assembly, and Automated Assembly (DFM/DFA/DFAA), structural test strategies, tooling design, concept costing, and scaling customer-specific processes.

• Quality Assurance, Inspection & Failure Analysis: Comprehensive testing, inspection, and reliability modeling. This includes automated optical and X-ray inspection (AOI/AXI), rigorous lab failure analysis (SEM, FTIR, HALT/HASS, thermal/vibration testing), and strict adherence to IPC-610 standards and quality KPIs.

Typical Experience

• 15+ years

Typical Education

Bachelor degree or consideration of an equivalent combination of education and experience.

Educational Requirements may vary by Geography

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.